1.The machine leverages the Company’s innovative design based on current market
demand, designed with the latest chip technology for a simple BGA desoldering station
that integrates far-infrared lights, a preheat station, and a soldering station.
2.The WEP-1000B model also combines four hot air gun features in one machine!This
model can be used for desoldering parts with poor reception of infrared light. Meanwhile,
this machine only takes up a small amount of work surface space. This practical, energy-efficient, powerful machine can meet all routine or professional application needs!
3.With the pioneering, industry-first user-friendly design, the infrared desoldering uses
the latest security probe for real-time tracking of desoldering IC surface temperatures to
prevent heat damage to desoldered parts for safe applications regardless of user skill.
4.The hot air gun employs microchip-PID programming for high-speed 100ms
real-time tracking of air gun outlet temperatures and soldering iron tip temperatures, with
real-time calibration! Temperatures are extremely stable.
5.Soldering iron handle wire employs a high-temperature silicone wire (undamaged when
300o soldering tip contacts silicone wire for 30 seconds); the heating element employs an
imported high-power heating element for fast temperature compensation, particularly
suitable for desoldering crude terminals, large joints, and difficult to reach spots, not to
mention general solder joint desoldering.
6.The machine features -50℃ to +50℃ temperature compensation. The infrared light
features 5-80 power adjustment.
7.Celsius/Fahrenheit Display Temperature Function: To satisfy market demand in different
regions, the Company has designed a temperature display mode.
|Rated Voltage||AC 110V±10% 60Hz|
|300℃ Constant Temperature
Programmed to Energy Savings)
|Operating Environment||0~40℃ Relative
|Storage Temperature||-20~80℃ Relative
|Performance Parameter||Hot Air Gun||Soldering Iron|
|Operating Voltage||AC 110V±10% 60Hz|
|Air Supply Mode||Brushless-Motor Fan||—|
|Temperature Stability||±1℃ (Static)||±1℃ (Static)|
|Display Mode||Red LED
|Calibration Mode||PID Digitally
|Rapid 20ms||High-Speed 100ms|
|Heating Core||Ceramic Framed
|Infrared Light||Preheat Station|
|Operating Voltage||AC 110V±10% 60Hz||Operating Voltage||AC 110V±10% 60Hz|
|Max. Power||150W||Output Power||600W|
|Effective Irradiated Area||30*30mm||Heated Region Area||130X130mm|
|Display Mode||Red/Green LED
|Display Mode||Red/Green LED
|K-type Thermocouple||Temperature Sensor||K-type Thermocouple|
1). Suitable for desoldering and soldering BGA, SOIC, CHIP, QFP, PLCC package SMD IC,
Particularly suitable for desoldering BGA module, computer motherboard north and south
bridge, all kinds of mobile phone motherboard SMT IC and LED lights.
2). Shrinking, Paint drying, adhesive removal, thawing, warming, Plastic welding etc.