Voltage: AC110V / 60HZ
Infrared lamp body power: 120W
Preheating plate power: 600W
Working bench size: 360*270mm
Infrared lamp body heating size: 35*35mm
Preheating plate size: 120*120mm
Preheating plate temperature range: 60-200°C
Infrared lamp body temperature range: 100-350°C
1. Infrared welding technology which was developed independently.
2. Infrared heating is easy to pierce and distribute evenly,can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; user can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 35mm.
With hot melt system, preheating range 120*120mm.
5. It doesn’t impact the smart parts without hot air, and suits to weld all kinds of chips, especially Micro BGA components.